New Facing Targets Sputtering System
Overview | Features | Principle | Applications | Product Information
Product Information
Product Information | Box-shaped Source | Rotary Substrate | Stationary Substrate | In-line Substrate | Web-coater
Box-shaped Plasma Source
Small Box-shaped plasma sources on the vacuum chamber
Small Box-shaped plasma sources
NFTS plasma sources consist of the structure in which the magnets forming magnetic fields are specially designed to arrange outside of the main targets, not beneath the backing plate. This magnet arrangement makes it possible to uniform highly densed sputtering plasma almost all over the target surfaces in the case of not only small sized square or circular targets but also large sized rectangle targets for wide area coating under high confinement of plasma bombardment on the deposition surface. For this reason, NFTS equipment is able to produce an equal thin film quality and thickness across a wide area.
Moreover, these box shaped plasma sources have spaces behind the backing plates to easily adjust the magnetic field generated on target surfaces for the control of plasma flow inside space of the plasma source. As a result, NFTS plasma sources are able to obtain high target material utilization for various target materials. Additionally, in reactive sputtering with oxygen or nitrogen gas, NFTS plasma sources allow preparation of high quality oxide or nitride thin films at a high deposition rate, low temperature and low plasma damage compared to conventional magnetron sputtering methods.
NFTS plasma sources respond from 12 × 12cm sized square targets to rectangular targets of a few meters. All sizes of NFTS plasma sources utilize the same principle of plasma confinement and thin film deposition. Therefore, customers are able to produce using mass production type NFTS equipment (with large sized plasma sources) based on the development using laboratory grade NFTS equipment (with small sized plasma sources)