New Facing Targets Sputtering System
Overview | Features | Principle | Applications | Product Information
Features
Features | Thin Film Properties
Facing targets structure
- Confinement of sputtering plasma
- Suppression of high energy particles bombardment on substrates
- Low damage on substrate surface
- Suppression of a large amount of electrons on substrates
- Low temperature on substrate surface
Original magnets arrangement
- Generation of sputtering plasma on whole target surfaces
- Efficient targets utilization
- Stable sputtering plasma for large sized targets
Box shaped plasma source
- Separation of plasma sources from vacuum chamber
- Easily handling and maintenance
- Compact vacuum chamber
Image of NFTS sputtering plasma